Our newly developed VIA® (Variable Interface Adapter) is designed for board-to-board and board-to-filter RF interconnections in todays and future 5G applications. The enhancement of the mechanical design is outstanding: limited detent and smooth bore interfaces are integrated into the adapter – one side of the adapter has mechanical retention to provide limited detent and the other side is smooth bore. The same PCB type could be used on both sides of the connection. For our customers, this results in a lower number of different parts on the BOM and lower costs.
The VIA® series is characterized by several key features among superior RF-performance up to 6 GHz, as well as a wide axial of ±1 mm and radial misalignment of 4°.